Electroplating

Today, PC/ABS materials are predominantly used for plastic electroplating. The quality of electroplated plastic surfaces is significantly influenced by the manufacturing conditions of the plastic parts. High rejection rates often occur due to pimples, specks, blisters, or insufficient layer adhesion. The causes for these defects can be found in both the injection molding process and the electroplating process.

Injection molding defects on the raw part are usually also visible on the finished electroplated component. However, hidden defects not observed on the raw part can be amplified and thus become visible during the electroplating process. Additionally, there are defect patterns that are attributable to deposition disturbances in electroplating, aging of the baths, or unsuitable electroplating conditions.

A systematic, microscopic analysis of the finished part and the raw part helps to determine the causes of defects in electroplated plastic parts and reduce rejection rates.

In addition to electroplating, plastics are increasingly being coated with a thin metal layer applied by sputtering, which is then covered with a protective lacquer. Especially with these processes, it is crucial that the surface does not exhibit any undesirable structures. Metallization amplifies the smallest surface irregularities due to the mirror effect.